s d m 1 0 9 n - r 2 5 m f (a) (c) (b) (e) (d) 1. part no. expression : (b) dimension code (c) inductance code : r25 = 0.25uh (a) series code 2. configuration & dimensions : a 4. materials : superworld electronics (s) pte ltd (a) core : m-iron core (c) adhesive : epoxy 3. schematic : (d) tolerance code : m = 20% (e) f : lead free sdm109n series molding type dip inductors pg. 1 note : specifications subject to change without notice. please check our website for latest information. 18.04.2008 pcb pattern 10.5 max. 10.0 max. 3.40.5 bcd 10.5 max. (b) wire : enamelled copper wire unit:m/m 5.31.0 1.30.1 7.50.5 f wl e 5.31.0 r50 a b e ?w f c d 11.5 o p 11.5 b) frequency up to 1mhz a) shielded construction 5. features : m 7.5 typ. m ? n 1.6 typ. ?n 5.30.15 5.30.15 op l
superworld electronics (s) pte ltd 6. general specification : d) irms (a) : will cause an approximately temp. rise < 40c typ. c) ambient temp. : 25c b) operating temp. : -25c to +125c a) test frequency : 100khz/1.0vdc sdm109n series note : specifications subject to change without notice. please check our website for latest information. pg. 2 18.04.2008 e) isat (a) : will cause l to drop approximately 20% typ. 0 f) part temperature (ambient + temp. rise) : should not exceed 125c under worst case operating conditions. molding type dip inductors 20% @ 0adc inductance l ( uh ) 0.50 0.56 0.25 7. electrical characteristics : sdm109n-r25mf sdm109n-r56mf sdm109n-r50mf part no. 35 20 20 20 30 32 min. q 0 irms typ. ( a ) 0.8 40 35 1.0 38 1.0 dcr isat max. ( a ) ( m ) max. 0.68 SDM109N-R68MF 15 30 35 1.3 0.80 sdm109n-r80mf 15 10 20 1.3 8. characteristics curves : inductance vs. frequency dmpi109n freq ue ncy(mhz) in du ct an ce (u h sdm109n series
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 18.04.2008 8. characteristics curves : sdm109n series dc current vs. inductance & temperature rise molding type dip inductors 0 10 20 304050 60 dc current(a) 0 0.1 0.2 0.3 0.4 0.5 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) dmpi109n-r25 sdm109n-r25mf 0918273645 dc current(a) 0 0. 25 0.5 0. 75 1 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. ri se( o c) dmpi109n-r50 sdm109n-r50mf 0 10203040 dc current(a) 0 0.25 0.5 0.75 1 inductance (uh) 0 20 40 60 80 100 temp. rise( o c) dmpi109n-r56 sdm109n-r56mf 0 9 18 27 36 45 dc current(a) 0 0.25 0.5 0.75 1 inductance (uh) 0 10 20 30 40 50 60 70 80 90 100 temp. rise( o c) dmpi109n-r68 SDM109N-R68MF 0 5 10 15 20 25 dc current(a) 0 0. 2 0. 4 0. 6 0. 8 1 inductance(uh) 0 5 10 15 20 25 30 35 40 45 50 temp. ris e( o c) dmpi109n-r80 sdm109n-r80mf
superworld electronics (s) pte ltd sdm109n series note : specifications subject to change without notice. please check our website for latest information. pg. 4 18.04.2008 performance refer to standard electrical characteristics list should be covered with solder. more than 90% of the terminal electrode preheating 60 seconds 1. appearance : no significant abnormality 2. inductance change : within 3% preheating 60 seconds no disconnection or short circuit. 2. inductance : within 3% of initial value. 1. appearance : no damage no disconnection or short circuit. 2. inductance : within 5% of initial value. 1. appearance : no damage reliability test humidity resistance high temperature life test life test low temperature thermal shock solder heat resistance 150c 260c 150c 245c inductance electrical characteristics test dcr heat rated current (irms) solderability test mechanical performance test saturation current (isat) 9. reliability and test condition : item time : 50012 hours applied current : rated curent humidity : 90% to 95% temperature : 405c temperature : 855c time : 50012 hours temperature (c) conditions of 1 cycle. temperature : -405c time : 50012 hours room temperature room temperature 853 -253 recovery: 4 to 24hrs of recovery under the standard 2 total : 5 cycles 4 3 step 1 within 3 within 3 303 times (min.) 303 preheat : 150c, 60sec. solder : sn99.95-cu0.05 solder temperature : 2605c flux : rosin dip time : 100.5sec. 100.5 seconds dipping cooling natural 41 seconds dipping cooling natural hp-4192a, hp4284a, ch1320 test condition isat(a) will cause lo to drop approximately 25% agilent 33420a irms(a) will cause an temp rise < 40c typ. solder bath at 2455c for 5 seconds after fluxing, component shall be dipped in a melted condition after the removal from test chamber condition after the removal from test chamber recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber recovery: 4 to 24hrs of recovery under the standard molding type dip inductors
superworld electronics (s) pte ltd sdm109n series note : specifications subject to change without notice. please check our website for latest information. pg. 5 18.04.2008 b) 280c tip temperature (max) temperature c e) use a 20 watt soldering iron with tip diameter of 1.0mm temperature c 30~60s figure 1. re-flow soldering f) limit soldering time to 3 secs. d) 1.0mm tip diameter (max) 10s max. preheating 60~120s c) never contact the ceramic with the iron tip 180 150 250~260 230 natural soldering cooling over 1min. figure 2. iron soldering within 3secs. gradual cooling natural preheating soldering 150 350 300 cooling wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, ch ip and substrate. our terminations are suitable for all mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a soldering iron must be employed the following precautions are recommended. 10-2.1 solder re-flow : air soldering tools. a) preheat circuit and products to 150c. 10-2.2 soldering iron (figure 2) : note : 10-1. recommended pc board pattern 10. solderind and mounting : 10-2. soldering molding type dip inductors 5.30.15 11.5 7.5 typ. 5.30.15 ? 1 . 6 t y p . 11.5
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 6 18.04.2008 sdm109n series 11. packing and quantity : inner box carton 1000 2000 styrofoam size 100 sdm109n a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. application notice 2. transportation : c) bulk handling should ensur e that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) recommended products should be used within 6 months from the time of delivery. a) temperature and humidity conditions : less than 30c and 70% rh. to maintain the solderabililty of terminal electr odes : 1. storage conditions : molding type dip inductors
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